Do AI Chips Pose Different Quality and Reliability Challenges for Semiconductor Package Technology?

AI accelerators are pushing semiconductor packaging into uncharted territory: multi-die, multi-foundry chiplet stacks, hybrid bonding, co-packaged optics, intense AI workloads, extremely large form factors, power exceeding 1kW per package, high yield expectations and low field DPM requirements. Development is further challenged by aggressively compressed time-to-market windows that limit the time available for product maturation. While the technology shifts create new interactions between thermal, mechanical, and electrical stresses, the fast development cycles are straining the sampling plans, FMEAs, test and burn-in strategies that companies have long relied upon to deliver high yielding and reliable products. The talk will examine the changing package architecture to meet AI product needs from the large form factors that accommodate different silicon node chiplets to integration of optical and electronic components on the same package technology.  The classic and emerging testing needs, and failure modes that need to be accommodated for these AI chips.  The audience will get a flavor of quality and reliability strategy necessary to enable high-quality AI hardware.

Biography:

Shubhada Sahasrabudhe is a dynamic and impact-driven senior technical leader with a distinguished career in semiconductor Quality and Reliability (Q&R). With a strong background in product quality, innovation, and technology development, she has played a pivotal role in enhancing industry-wide quality strategies and fostering collaborations with major Data Center Companies. Her expertise spans quality modeling, testing methodologies, and customer quality experience, making her an invaluable asset in driving technological and business innovation. She has 9 patents and over 30 publications. She is a co-chair of IEEE Heterogeneous Integration Roadmap Reliability Chapter. She has received multiple awards including “2021 woman in engineering” award by American Society of Mechanical Engineers.

Shalabh Tandon is a versatile and adaptive executive leader with expertise in semiconductor Quality and Reliability (Q&R), product development, behavior of Polymers and high-volume manufacturing. With a PhD in Polymer Science and Engineering, he has led complex technical initiatives, handled problem resolution across products with functional, security, and supply chain implications